Yong Xiao, Qiwei Wang, Ziqi Wang, Xian Zeng*, Mingyu Li, Ling Wang, Xiaomeng Zhu. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer, Ultrasonics Sonochemistry, 2018, Accept. (SCI, IF=4.218)

Xingyi Zhang, Yong Xiao*, Ling Wang, Chao Wan, Qiwei Wang, Hongchao Sheng, Mingyu Li. Ultrasound-induced liquid/solid interfacial reaction between Zn-3Al alloy and Zr-based bulk metallic glasses, Ultrasonics Sonochemistry, 2018, Accept. (SCI, IF=4.218)

Yong Xiao, Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Jue Xiao, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International, 2017, 43(16): 14314-14320. (SCI, IF=2.758)

Dan Luo, Yong Xiao*, Ling Wang, Li Liu, Xian Zeng, Mingyu Li. Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves, Ceramics International, 2017, 43(10): 7531-7536. (SCI, IF=2.758)

Yong Xiao, Mingyu Li*, Ling Wang, Shangyu Huang, Xueming Du, Zhiquan Liu*. Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints. Materials & Design, 2015,73:42-49. (SCI, IF=3.501)

Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-induced equiaxial flower-like CuZn5/Al composite microstructure formation in Al/Zn-Al/Cu joint. Materials Science and Engineering A, 2014, 594:135-139. (SCI, IF=2.567)

Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim, Hongbae Kim. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal. Materials & Design, 2013, 47:717–724. (SCI, IF=3.501)

Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design, 2013, 52:740-747. (SCI, IF=3.501)

Yu Lei, Shangyu Huang, Wei Liu*, Yong Xiao, Jianhua Hu, Xueming Du, Xifan Zou. Dissimilar Cu/Al tube joint by EMF-assisted brazing. The International Journal of Advanced Manufacturing Technology, 2018,1:1-9. (SCI)

Qiwei Wang, Yong Xiao*, Xingyi Zhang, Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder, ICEPT,2017, 18th. (EI)

八、联系方式：

1、Tel:

2、E-mail: yongxiao@whut.edu.cn

3、工作地址(实验室)：马房山校区东院成型系办公楼(红房子)104室

1. Name: Yong Xiao

2. Brief introduction:

1) Date of birth: 1985-01-

2) Degree: Ph.D

3) Title: Associate Professor

4) Working department:

Department of Material shaping and Processing Engineering, School of Materials Science and Engineering

3. Education experience (after entering university):

2010/09-2014/07, Harbin Institute of Technology, Material Processing Engineering, Doctor degree.

2008/09-2010/07, Harbin Institute of Technology, Material Processing Engineering, Master degree.

2004/09-2008/07, China Three Gorges University, Material Shaping and Control Engineering, Bachelor degree.

4. Working experience:

2014/10-2016/09, School of Materials Science and Engineering, Wuhan University of Technology, Associate Professor.

2014/10-2016/09, School of Materials Science and Engineering, Wuhan University of Technology, Assistant Professor.

5. Research field (no more than 3):

1) Brazing materials and technology

2) Special materials joining technology

6. Research project (no more than 5):

[1] Study on the bonding mechanism of ultrasound-assisted low-temperature soldering of ultrafine grained Al alloy, National Nature Science Foundation of China (No. 51605357), 2017.01-2019.12. (P.I.)

[2] Study on the metallurgic bonding mechanism between Ni-foam/Sn liquid/solid composite solders and Al substrates, Nature Science Foundation of Hubei Province (2016CFB335), 2016.01-2017.12. (P.I.)

[3] Study on the reliability of Pb-free solder, Enterprise Research Project (20151h0275), 2017.01-2019.01. (P.I.)

[4] Study on the induction coil magnet and its heating mechanism, Enterprise Research Project (20151h0275), 2017.12-2018.10. (P.I.)

[5] High-speed brazing of thick wall copper/brass/bronze dissimilar tubes, Enterprise Research Project (20171h0420), 2017.10-2018.03. (P.I.)

7. Representative papers and works (no more than 10)：

Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design, 2013, 52:740-747. (SCI, IF=3.501)

Qiwei Wang, Yong Xiao*, Xingyi Zhang, Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder, ICEPT,2017, 18th. (EI)

8. Contact information：

1) Tel：

2) E-mail：yongxiao@whut.edu.cn

3) Location of office： Room 104, The red house in Eastern Campus.

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